GitHub-Mirror/Star64_linux
2
0
Fork 0
mirror of https://github.com/Fishwaldo/Star64_linux.git synced 2025-06-07 15:18:15 +00:00
Code Issues Projects Releases Packages Wiki Activity Actions

thermal/x86_pkg_temp_thermal: Support multi-die/package

Browse source 
Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.

Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
This commit is contained in:
Zhang Rui 2019-05-13 13:58:52 -04:00 • committed by Thomas Gleixner
parent 32fb480e0a
commit 724adec33c
1 changed files with 4 additions and 4 deletions
Show stats Download patch file Download diff file Expand all files Collapse all files

8
drivers/thermal/intel/x86_pkg_temp_thermal.c
View file

@ -122,7 +122,7 @@ err_out:
*/ */
static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu) static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
{ {
int pkgid = topology_logical_package_id(cpu); int pkgid = topology_logical_die_id(cpu);
if (pkgid >= 0 && pkgid < max_packages) if (pkgid >= 0 && pkgid < max_packages)
return packages[pkgid]; return packages[pkgid];
@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
static int pkg_temp_thermal_device_add(unsigned int cpu) static int pkg_temp_thermal_device_add(unsigned int cpu)
{ {
int pkgid = topology_logical_package_id(cpu); int pkgid = topology_logical_die_id(cpu);
u32 tj_max, eax, ebx, ecx, edx; u32 tj_max, eax, ebx, ecx, edx;
struct pkg_device *pkgdev; struct pkg_device *pkgdev;
int thres_count, err; int thres_count, err;
@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
* worker will see the package anymore. * worker will see the package anymore.
*/ */
if (lastcpu) { if (lastcpu) {
packages[topology_logical_package_id(cpu)] = NULL; packages[topology_logical_die_id(cpu)] = NULL;
/* After this point nothing touches the MSR anymore. */ /* After this point nothing touches the MSR anymore. */
wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT, wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high); pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
if (!x86_match_cpu(pkg_temp_thermal_ids)) if (!x86_match_cpu(pkg_temp_thermal_ids))
return -ENODEV; return -ENODEV;
max_packages = topology_max_packages(); max_packages = topology_max_packages() * topology_max_die_per_package();
packages = kcalloc(max_packages, sizeof(struct pkg_device *), packages = kcalloc(max_packages, sizeof(struct pkg_device *),
GFP_KERNEL); GFP_KERNEL);
if (!packages) if (!packages)