usb: dwc3: exynos: remove non-DT support for Exynos Specific Glue layer

DWC3 Exynos Specific Glue layer can be used only for Exynos SoCs.
In addition, non-DT for EXYNOS SoCs is not supported from v3.11;
thus, there is no need to support non-DT for DWC3 Exynos Specific
Glue layer.

The 'linux/platform_data/dwc3-exynos.h' file has been used for
non-DT support. Thus, the 'dwc3-exynos.h' file is removed, because
it is not used anymore.

Signed-off-by: Jingoo Han <jg1.han@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
This commit is contained in:
Jingoo Han 2014-11-04 11:01:47 +09:00 committed by Felipe Balbi
parent cdeb794313
commit b4c9f578cb
3 changed files with 2 additions and 29 deletions

View file

@ -1,24 +0,0 @@
/**
* dwc3-exynos.h - Samsung EXYNOS DWC3 Specific Glue layer, header.
*
* Copyright (c) 2012 Samsung Electronics Co., Ltd.
* http://www.samsung.com
*
* Author: Anton Tikhomirov <av.tikhomirov@samsung.com>
*
* This program is free software; you can redistribute it and/or modify
* it under the terms of the GNU General Public License as published by
* the Free Software Foundation; either version 2 of the License, or
* (at your option) any later version.
*/
#ifndef _DWC3_EXYNOS_H_
#define _DWC3_EXYNOS_H_
struct dwc3_exynos_data {
int phy_type;
int (*phy_init)(struct platform_device *pdev, int type);
int (*phy_exit)(struct platform_device *pdev, int type);
};
#endif /* _DWC3_EXYNOS_H_ */