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usb: dwc3: exynos: remove non-DT support for Exynos Specific Glue layer
DWC3 Exynos Specific Glue layer can be used only for Exynos SoCs. In addition, non-DT for EXYNOS SoCs is not supported from v3.11; thus, there is no need to support non-DT for DWC3 Exynos Specific Glue layer. The 'linux/platform_data/dwc3-exynos.h' file has been used for non-DT support. Thus, the 'dwc3-exynos.h' file is removed, because it is not used anymore. Signed-off-by: Jingoo Han <jg1.han@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com>
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3 changed files with 2 additions and 29 deletions
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/**
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* dwc3-exynos.h - Samsung EXYNOS DWC3 Specific Glue layer, header.
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*
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* Copyright (c) 2012 Samsung Electronics Co., Ltd.
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* http://www.samsung.com
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*
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* Author: Anton Tikhomirov <av.tikhomirov@samsung.com>
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*
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* This program is free software; you can redistribute it and/or modify
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* it under the terms of the GNU General Public License as published by
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* the Free Software Foundation; either version 2 of the License, or
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* (at your option) any later version.
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*/
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#ifndef _DWC3_EXYNOS_H_
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#define _DWC3_EXYNOS_H_
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struct dwc3_exynos_data {
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int phy_type;
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int (*phy_init)(struct platform_device *pdev, int type);
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int (*phy_exit)(struct platform_device *pdev, int type);
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};
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#endif /* _DWC3_EXYNOS_H_ */
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